• On Monday, June 1 , 2026, Foxconn, Radiall and Thales laid the foundation stone of their future joint venture in Le Barp (Nouvelle-Aquitaine) as part of the Choose France 2026 Summit, in the presence of the French Minister Delegate for Industry, Sébastien Martin, the President of S Business Group of Hon Hai Technology (Foxconn), Dr. Bob Wei-Ming Chen, the Chairman and CEO of Radiall, Pierre Gattaz, the Chairman and CEO of Thales, Patrice Caine, and the President of the Nouvelle-Aquitaine Region, Alain Rousset.
  • This company, named Tessalia Technology SAS, will be dedicated to outsourced semiconductor assembly and testing (OSAT). It aims for a production capacity of more than 50 million System-in-Package (SiP) components per year by 2033.
  • Within the framework of the EU Chips Act, this project represents a major step forward in strengthening the French and European semiconductor ecosystem, increasing its innovation capacity, strategic autonomy and competitiveness.

One year after the announcement by the President of the French Republic, Emmanuel Macron, at the Choose France 2025 Summit, of preliminary discussions between Hon Hai Technology Group (Foxconn), Radiall, and Thales, the three companies laid the foundation stone for their future joint venture on Monday, June 1, 2026, in Le Barp, near Bordeaux (Nouvelle-Aquitaine). Le Barp is located at the heart of a rich academic and industrial ecosystem, near the Route des Lasers (Laser Route) and numerous cleanrooms, and boasts a significant pool of expertise in these fields.

Foxconn, the world’s largest provider of electronic manufacturing services, Radiall, a global manufacturer of advanced interconnect solutions for the most demanding industries, and Thales, a global leader in high technology, have named this new company Tessalia, a reference to mosaic tiles (from the Latin “tessella”). They are joining forces to create, test, and assemble advanced packaging solutions for Systems-in-Package (SiP) chips for the aerospace, telecom infrastructure, automotive, medical, and industrial sectors. Tessalia will use innovative encapsulation technology to develop ultra-high-density packaging. This will simplify printed circuit boards (PCBs) and create smaller, lighter components, thus improving their integration capabilities. This technology is poised to be a game-changer in terms of yield and competitiveness for future products.

Tessalia’s ambition is:

  • To be a sovereign and competitive company capable of meeting European needs in the field of semiconductor packaging in sectors that are strategic for Europe. Tessalia will have access to Foxconn’s technology under licensing agreements.
  • To offer its customers a single interface to manage the entire production of advanced packaging for electronic chips. This verticalized approach simplifies the packaging stage and reduces cycle time. It also minimizes the sector’s carbon footprint by reducing back-and-forth with multiple suppliers located worldwide;
  • To be an autonomous and open player capable of steering the European packaging market ecosystem.

Production is expected to begin at the end of 2029 and reach more than 50 million System in Package (SiP) components per year by 2033. This initiative aims to attract other industrial players to support an investment that could exceed €250 million by 2033. Tessalia is expected to have 800 employees at full production capacity.

In a context of exploding demand for electronic equipment and Artificial Intelligence, and geopolitical tensions disrupting global supply chains, semiconductor production has become a major strategic issue, leading to a reorganization of the sector, an acceleration of production capacities and the development of new technologies.

“Today’s announcement demonstrates that in the space of a year, from one ‘Choose France’ summit to the next, a strategic project has been able to realize its vision by choosing Le Barp as the location for a unique factory in Europe, which completes the semiconductor value chain and strengthens European sovereignty. Foxconn’s decision, alongside Thales and Radiall, testifies to the confidence placed in France’s attractiveness as a technological and industrial hub in the semiconductor sector,” declared Sébastien Martin, Minister Delegate for Industry.

“ This is not simply a factory. It is a strategic platform dedicated to advanced manufacturing, the resilience of the semiconductor industry, and future technologies in Europe. This project is also part of Foxconn’s ‘Build, Execute, Locate’ strategy, which aims to expand our global technology presence through trusted partnerships, ” commented Young Liu, Chairman of the Board, Foxconn.

“This major new technological expertise represents a key sovereign asset for the French and European semiconductor industry. This project fits perfectly into Radiall’s strategy, enabling the development of our next advanced connectivity solutions for demanding applications,” adds Pierre Gattaz, Chairman and CEO, Radiall.

“ The laying of this foundation stone today attests to our shared ambition, with Radiall and Foxconn, to build an innovative and competitive European player in the advanced semiconductor packaging market, in a context of strong competition. Tessalia is part of a dynamic of independence and control of the value chain of Thales’ electronic products, ” declares Patrice Caine, Chairman and CEO, Thales.

“I am delighted to welcome this strategic factory, which is crucial to our autonomy in the electronics sector. It strengthens our regional ecosystem in this field, which already represents 20,000 jobs. This project also crowns our long-standing efforts in reindustrialization, which have enabled us to become the leading region in France in terms of factory creation,” declared Alain Rousset, President of the Nouvelle-Aquitaine region.