- New Hardware and Software Development Kit Accelerates Thermal Imaging and AI Integration at the Edge.

At the heart of the kit is the Teledyne FLIR OEM AVP, powered by the Qualcomm® Dragonwing™ QCS8550 system-on-chip (SoC), which delivers an industry-leading 50 trillion operations per second (TOPS) with a typical power draw of just 2.5 watts. Its multicore architecture supports Prism AI object detection models and Prism ISP features, including denoising and super resolution to provide exceptional image clarity in challenging environments.
The Boson+ IQ Dev Kit represents a major leap forward for integrators building smarter, more efficient thermal systems at the edge with AI particularly for autonomy applications such as aerial drones, loitering munitions, and ground-based robotics,” said Jared Faraudo, vice president of product management and programs, Teledyne FLIR OEM. “By combining our high-performance Boson+ thermal camera with Prism AI and ISP software on a cutting-edge Qualcomm compute platform, we’re enabling faster development cycles, industry-best image quality, and longer mission endurance with minimal power consumption.”

The Boson+ IQ Development Kit is future-ready, with compatibility for upcoming additions, including Prism SKR and Prism Supervisor. Prism SKR facilitates autonomous target detection and terminal guidance, while Prism Supervisor offers autonomous operation to designated way points via GPS or visual-based navigation (VBN) location technology. These software-enabled features can add powerful capabilities to mission-critical applications in defense, security, and industrial automation.
Experience the Boson+ IQ Development Kit in action at the Teledyne FLIR stand (#S3-110) during DSEI UK at ExCeL London, Sept. 9–12, one of the world’s premier defense and security exhibitions.




















