Cobham’s Radiation-Hardened OBC Reference Design Revealed Cobham’s Radiation-Hardened OBC Reference Design Revealed

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Cobham’s radiation-hardened Onboard Computing reference design revealed

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Onboard Computing

Arlington, Virginia. 06 August 2019. UK based Cobham has revealed a radiation-hardened Onboard Computing (OBC) reference design to boost the development of space computing equipments including CubeSats, these Cubesats operates in low-orbit Earth for remote sensing and communications like applications, and due to their advantages such as their compact size, standardiztion.


Kevin Jackson, Vice-Predent and General Manager of Semiconductor and Space Solutions at Cobham Advanced Electronic Solutions, asserted, “Leveraging our expertise developed over decades of providing radiation-hardened, high reliability components as well as our software expertise for space and satellite systems, this OBC Reference Design offers extensive benefits by combining Cobham’s best-in-class high reliability components and software IP to enable prolonged missions and larger payloads while significantly reducing time-to-market and development risk.”
To put it into a Cubesat, Cobham‘s OBC Reference Design features company’s GR712RC LEON3FT Dual Core Microprocessor, which can fit into as small as 100 square centimetre footprint. All elements are radiation-tolerant up to 100 krad(Si) TID. The Design also consists of software support including; board support package, boot software, peripheral drivers and a path for software validation.


“From Apollo to today’s commercial mega constellations, CAES has a long heritage of providing world leading space technologies. Our semiconductor, RadHard, high reliability microelectronic products are recognized for their rich feature set, performance, pedigree, and dependability. They have powered hundreds of missions including NASA InSight, Parker Solar Probe, and numerous commercial, military and government satellites. We look forward to continuing our heritage of innovation through our new cost-effective LeanREL™ ICs, OBC solutions, and more,” Kevin added.

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